TIN/LEAD SOLDER PLATING PER ASTM B579
A leader in the metal finishing industry since 1928, Keystone Corporation provides high quality electrodeposited tin/lead (solder) plating for industrial and electronic applications. Tin/lead plating (also known as solder plating) is a co-deposition of tin and lead that provides unsurpassed solderability in critical electronic applications. Alloying a tin plated deposit with lead eliminates the potential for tin whisker growth. Keystone’s Bright solder plating provides an aesthetically appealing reflective finish without the need for reflow.
TIN/LEAD PLATING APPLICATIONS
Keystone Corporation’s tin/lead plating is available for both Rack and Barrel applications. Keystone offers the following alloy compositions in both Bright and Matte finishes:
- 60/40 (60% Tin 40% Lead)
- 90/10 (90% Tin 10% Lead)
- 95/5 (95% Tin 5% Lead)
- Other alloy compositions available upon request
SPECIFICATIONS
- MIL-P-81728
- AMS-P-81728
- ASTM B579
- Commercial and customer generated specifications
Contact Keystone Corporation for more information about our Tin/Lead Plating
For more than 90 years, Keystone Corporation has assisted customers in completing commercial orders ranging from a few specialized pieces to high volume applications. All finishes are available for both Rack and Barrel plating applications. We maintain superior quality control through the entire finishing process, ensuring top quality Tin/Lead plating at an affordable cost for any project. Our experienced staff will provide technical assistance as well as Certificates of Compliance to commercial, government, AMS, ASTM, and MIL specifications. Meeting your manufacturing needs is our top priority at Keystone Corporation. Contact us today to receive a personalized quotation based on your specific requirements.
